Qualcomm 授權華為 LogicFolding 晶片技術專利
Qualcomm licenses patents on Huawei’s LogicFolding chip tech
Qualcomm 同意授權華為的 LogicFolding 晶片製程技術專利，成為華為在海外 AI 市場進軍的重要一步。
- - 跨授權協議：涵蓋 5G、AI、光學與網路技術。
- - 雙方收益：Qualcomm 可進一步進入華為技術領域，華為加速海外 AI 產品佈局。
- - 市場意義：顯示兩大晶片巨頭在技術上互補，可能改變全球晶片競爭格局。
Qualcomm Licenses Patents on Huawei’s LogicFolding Chip Tech - Bloomberg
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Qualcomm Licenses Patents on Huawei’s LogicFolding Chip Tech
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By Bloomberg News
October 5, 2026 at 6:00 AM UTC
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Qualcomm Inc. has agreed to license patents underpinning Huawei Technologies Co.’s novel LogicFolding chipmaking technique, a win for the Chinese company and its push to advance in overseas AI markets.
The multiyear deal is part of a cross-license agreement between the two chipmakers, spanning technologies related to 5G devices, AI services, near- and co-packaged optics and networks, a Huawei spokesperson said Monday.
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