重點導讀
BOE 近日啟用每月 1,000 片 的試產線，已完成 24 層、尺寸 100mm × 100mm 的玻璃基板量產並通過客戶可靠性測試。
- 技術規格：24 層玻璃基板尺寸超過 100mm × 100mm，適用於 AI 晶片封裝。
- 產能與交付：試產線每月可處理 1,000 片，已完成首批 24 層基板出貨。
- 市場影響：BOE 可能在 AI 晶片封裝領域先於 Intel、Nvidia 供應商進入市場。
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X.PIN@thexpin
·2 小時前
Intel and Nvidia view glass substrates as the ultimate solution for next-generation AI chip packaging, but Chinese display giant BOE might beat their suppliers to market.
BOE recently revealed that its 1,000-wafer-per-month pilot line has already shipped 24-layer glass substrates measuring over 100 by 100 millimeters, all of which passed client reliability testing.
推文來源 · X (Twitter)在 X 參與討論